3.2.3.4 Pad general settings

  1. Solder & paste clearances shall be manually defined at library level and not rely on the default rules of Altium.
  2. Solder resist clearance shall have a default value of 4 thou.
  3. Solder paste clearance shall have a default value of 0 thou.
  4. Solder resist between pads shall be at least 8 thou.
  5. Solder resist between high density pads shall be at least 5 thou.
  6. Paste clearance between pads shall be at least 8 thou.
  7. Paste width shall be at least 10 thou for a 0.125mm stencil.
  8. Large pads under heat sinks and heat slugs shall be broken into sections to reduce skewing and quantity of solder.
  9. High density components may need solder resist clearance and solder paste reducing.
  10. Default stencils for SMT are currently 0.1mm.