Where possible the mothercard should be designed so that it is common to both the first slot and subsequent ones by the use of links (wire / solder or SMT components), see “Configuration Information” section. When links are present the ones that carry “Y” signals from the front panel connector - backplane connector should be positioned close to the backplane connector and with traces as short as possible to minimise stub lengths attached to the backplane.

For modules with front panel “Y” access it is only necessary to fit the front panel connector - backplane connector links on the first card.

Isolation relays should all be on the mothercard and positioned as close as possible to the backplane connector.

Each PCB (mothercard only in a mother / daughter module) to have the CE and WEEE logos (space permitting). Unlike PXI modules there is no specific positions for these identifiers but every effort should be made to ensure their relationship to each other (reference to Mech-2 footprint layer) is maintained ; the preference would be to have them located somewhere in the bottom left hand side corner of the PCB on the component side legend.

A strip of copper (1mm) is to be present on the top & bottom edges (component & solder side) of the mothercard that is connected to “FP_Ground” for earthing purposes. The exact dimensions of the strips may vary from module to module but a common format is they extend from the left hand edge to the 45 degree “step” having an approximate overall length of 117.8mm. Note, there are exceptions to this requirement such as the 40-566 (due to the use of the 160-way connector.

The PCB edge grounding strip should have its copper exposed i.e. no solder resist present.

Depending on the connector used to interface the plug-in cards to the BRIC backplane it may (1A versions) or may not (2A versions) be necessary to add a chamfer to the component side.