3.2.3.5 Through hole pads

  1. Through hole pads shall be circular.
  2. Through hole pads shall have the stack mode set to ‘simple’.
  3. Through hole pads shall be designed to the component manufacturer’s guidelines.
  4. In the absence of manufacturer’s guidelines through hole pads shall have a default hole size of pin dia. + 0.3mm.
  5. In the absence of manufacturer’s guidelines through hole pads shall have a top and bottom layer default pad size of hole size + 0.6mm
  6. In the absence of manufacturer’s guidelines through hole pads on alternative high density footprints shall have a pad size of hole size + 0.3mm
  7. Through hole pads shall for high current large holes shall have a pad that is twice the diameter of the hole.